Silver nanoparticles for low temperature and low pressure/no pressure sintering.
Sep 10,2015
Low-temperature sintering, low shrinkage, high thermal conductivity, low electrical resistance, high bonding strength, high reliability
It is dispersion of silver particles. A variety of grades are available with different particle sizes (100 to 500 nm), regands and solvents. By selecting appropriate silver submicron particles and mixing them into your silver paste, it is expected that the sintering properties and copper bonding properties will be improved. It is suitable as a silver paste material for low temperature, low pressure or pressureless sintering.
Silver nanoparticles for low temperature and low pressure/no pressure sintering.
Silver nanoparticles for low temperature and low pressure/no pressure sintering.
Sep 10,2015
Low-temperature sintering, low shrinkage, high thermal conductivity, low electrical resistance, high bonding strength, high reliability
It is dispersion of silver particles. A variety of grades are available with different particle sizes (100 to 500 nm), regands and solvents. By selecting appropriate silver submicron particles and mixing them into your silver paste, it is expected that the sintering properties and copper bonding properties will be improved. It is suitable as a silver paste material for low temperature, low pressure or pressureless sintering.
