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Sep 10,2015 Silver nanoparticles for low temperature and low pressure/no pressure sintering.
- Low-temperature sintering, low shrinkage, high thermal conductivity, low electrical resistance, high bonding strength, high reliability
- It is dispersion of silver particles.
A variety of grades are available with different particle sizes (100 to 500 nm), regands and solvents.
By selecting appropriate silver submicron particles and mixing them into your silver paste, it is expected that the sintering properties and copper bonding properties will be improved.
It is suitable as a silver paste material for low temperature, low pressure or pressureless sintering.
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Sep 10,2015 Highly ionic conductive polymer electrolyte
- Ionic conductivity, mechanical properties, processing properties
- Using our unique oxirane compound polymerization technology, we are proposing a polymer electrolyte that can dissolve inorganic/organic salts and provide ionic conductivity as an alternative to electrolytes used in lithium-ion secondary batteries. The use of polymer electrolytes can improve the safety and heat resistance of devices. It is a material that is expected to be used in all-solid-state batteries, which are attracting attention.
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Sep 8,2015 New film-forming polymers for cosmetics
- Water repellency, oil repellency, skin adhesion, sebum resistance
- New film-forming polymers for cosmetics
"The film-forming polymer ""OA Series"" is an acrylic polymer that is both water and oil repellent, water resistant and conforms to the skin.
It combines the characteristics of both silicone and acrylic polymers, and can be used as a film-forming agent for oil-based formulations such as hydrocarbon oils.
It is a material that can be expected to be effective in preventing makeup from coming off and wrinkles when used in makeup bases, foundations, sunscreens, skin care, etc. "
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Sep 8,2015 Adsorbent with copper ion selectivity
- Selective Adsorption
- This is an adsorbent that can selectively reacts with and stabilizes copper ions by modifying the surface of activated carbon with a chelating agent.
It is possible to adsorb copper ions without changing the composition or pH of the solution in various adsorption methods.
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