Low chlorine/high-purity epoxy resin to prevent corrosion of electric materials

 

With the miniaturization and high performance of information terminals such as smartphones and computers, materials containing low chlorine content as impurities are required to ensure the long-term reliability of electronic materials. To meet this demand, we developed epoxy resins with low chlorine content to prevent the corrosion of electronic materials. We have grades of bisphenol A type and F type epoxy resin with low chlorine content produced using our special technique. We are also focusing on developing custom grades and accept orders for low-chlorination.

Applications

Circuit boards of information terminals

[High-purity epoxy resin]

Semiconductor sealing materials

[High-purity epoxy resin]

[Other]

Underfill, Die bonding paste, Die bonding film, Conductive adhesives, etc.

Grades

LX-01(Bisphenol A type epoxy resin)

Basic property

Total Chlorine Content     <50 ppm

LX-02F(Bisphenol F type epoxy resin)

Basic property

Total Chlorine Content     <100 ppm

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